KaiZen offer services for the design stages; product transfer to production; prototype assembly and mass production.
Signal Integrity & Design to EMC
Pre & Post Lay Out simulations of regular & High Speed Boards, contiguously with customer PDR & CDR. Defining BRD: Layer Stuck-up & Traces Impedance, GND & Power Layers. Design BRD to meet EMC standards. Kaizen have the tools, experience and knowledge needed for Multi Drop Buses Signal Integrity.
Backplane (BP) interconnects signals between Plug In Units within multi cards system. Signals interconnected via the Backplane are:
Analysis for Boards and system to predict and ensure suitable temperature, ventilation, and heat distribution.
DFF, DFT, DFA, DFM check; automatic testing for manufacturability, assembly and testing of printed circuit boards, in order to detect design problems and prevent potential manufacturing failures.
NPI Support (New Product Introduction)
Preparation for prototype assembly; full support of pilot run; study of the pilot run, devising and implementing of solutions for the problems discovered.
Transferring complete product manufacturing process from one location to another.
Constructing BOM trees; component engineering; preparing manufacturing files and assembly instructions.
Design, Redesign & Reverse Engineering
Product Layout design for digital and RF product, Redesign of old product making the needed changes with our DFx tools, reconstruction of obsolete products.
Covering testing types such as ICT; JTAG; Function Test; System Test. Establishing the testing process at early stages of product design, for maximum coverage and reduction of manufacturing costs.
Manufacturer selection and drawing up the contract with the CM; defining desirable practice methods; selecting and adjusting manufacturing processes; defining logistical tools and processes – all in close referendum with the customer, tailored to meet customer specific needs.