KaiZen offer services for the design stages; product transfer to production; prototype assembly and mass production.

Signal Integrity & Design to EMC 

Pre & Post Lay Out simulations of regular & High Speed Boards, contiguously with customer PDR & CDR. Defining BRD: Layer Stuck-up & Traces Impedance, GND & Power Layers. Design BRD to meet EMC standards. Kaizen have the tools, experience and knowledge needed for Multi Drop Buses Signal Integrity.

Backplane Design        

Backplane (BP) interconnects signals between Plug In Units within multi cards system. Signals interconnected via the Backplane are:

• Defining System Connectors, due to System Speed and Signal Density.
• Point to Point (PTP) High Speed (Gbits Ser_Des) from one PIU to another PIU.
• Variable Loaded Buses, interconnecting System PIU assembled into any one of the Backplane Slots, up to fully loaded system.
• Power, 48Volt connected to all PIUs. In that case safety steps must be implemented within the BP Layout.
• Due to the fact that the BP is NON REPLACED PCB,at the customer site, it must be design & manufactured FREE FROM BUGS!

Thermal Analysis

Analysis for Boards and system to predict and ensure suitable temperature, ventilation, and heat distribution.

Valor DFX

DFF, DFT, DFA, DFM check; automatic testing for manufacturability, assembly and testing of printed circuit boards, in order to detect design problems and prevent potential manufacturing failures.

NPI Support (New Product Introduction) 

Preparation for prototype assembly; full support of pilot run; study of the pilot run, devising and implementing of solutions for the problems discovered.

Product transfer 

Transferring complete product manufacturing process from one location to another.
Fining 2^nd sources to increase production volumes.

Engineering Services 

Constructing BOM trees; component engineering; preparing manufacturing files and assembly instructions.

Design, Redesign & Reverse Engineering

Product Layout design for digital and RF product, Redesign of old product making the needed changes with our DFx tools, reconstruction of obsolete products.

Testability Solutions 

Covering testing types such as ICT; JTAG; Function Test; System Test. Establishing the testing process at early stages of product design, for maximum coverage and reduction of manufacturing costs.

Operational Support 

Manufacturer selection and drawing up the contract with the CM; defining desirable practice methods; selecting and adjusting manufacturing processes; defining logistical tools and processes – all in close referendum with the customer, tailored to meet customer specific needs.